Topic: Plasma pretreatment for printing. Better ink bonding and print adhesion of solvent-free inks. Printing on PP, PE, PA, PC, metal, glass, plastic.

Better ink bonding and highest print quality in all the usual printing processes thanks to plasma pretreatment

Openair® plasma technology is used as part of all the common printing processes like pad printing, screen printing, and offset printing. Plasma pretreatment makes print adhesion of solvent-free inks possible, as well as secure long-term adhesion when printing difficult surfaces like polypropylene (PP), polyethylene (PE), polyamide (PA), polycarbonate (PC), glass and metals. Openair® plasma's high efficiency makes it possible to significantly increase machine speeds. When tubs or tubes are printed, an increase in processing speeds of up to 30% can be achieved.

Quality improvement of the overall print appearance

Better ink bonding by using Openair®-plasma treatment before printing achieves increased aging resistance, high resistance to handling and weathering, excellent ink brilliance, and flawless application of printing inks. In contrast to the corona process, the uniform, potential-free effect of atmospheric plasma pretreats even thermally sensitive surfaces without damage.

Partners & References

Tampoprint AG

A matter of precision

Tampoprint AG was entrusted with the assignment of developing and building fully-automated pad printing for 5-color printing (screen illustration printing) on mint boxes, with an hourly output of 1800 units.

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Canada
Plasmatreat North America Inc.
1480 Sandhill Dr., Unit 8,
Ancaster, ON L9G 4V5
Canada

Phone: +1 905 304-5200
Fax: +1 905 304-5260

Contact: Mr. Tim Smith
tim.smith@plasmatreat.com


USA
Plasmatreat US LP
2541 Technology Drive, Suite 407
Elgin, IL 60124

Phone: +1 847-783-0622
Fax: +1 847-783-0991

Contact: Mr. Jeff Leighty
jeff.leighty@plasmatreat.com

 
 
O&S
International trade fair for surface treatments & coatings

12.06.2012 – 14.06.2012
Stuttgart Trade Fair Centre, Germany
www.ounds-messe.de

Bondexpo
Trade Fair for Industrial Bonding Technology

08.10.2012 – 11.10.2012
Stuttgart Exhibition Centre, Germany
www.bondexpo-messe.com/en/bondexpo

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