Topic: Gluing chips to circuit boards, improved adhesion in the flow process. Lead-free flow soldering.

Gluing Chips to Circuit Boards

Components are soldered to circuit boards in a cost-effective procedure called a wave soldering process. Up-to-date processes to accomplish this are typically lead-free. Wave soldering involves a higher temperature soldering bath, however, which in turn places greater demands on the adhesion of those components to the printed circuit board.
Kleben Chips LeiterplattenPlasma surface activation for improved adhesive performance
Surface activation of the components’ surfaces and the chips using Openair® plasma has shown a significant improvement in the performance of the adhesive used to fix the components in place for further processing in the solder bath.

back to main topic Wafers/Chips

Canada
Plasmatreat North America Inc.
1480 Sandhill Dr., Unit 8,
Ancaster, ON L9G 4V5
Canada

Phone: +1 905 304-5200
Fax: +1 905 304-5260

Contact: Mr. Tim Smith
tim.smith@plasmatreat.com


USA
Plasmatreat USA, Inc
2541 Technology Drive, Suite 407
Elgin, IL 60124

Phone: +1 847-783-0622
Fax: +1 847-783-0991

Contact: Mr. Jeff Leighty
jeff.leighty@plasmatreat.com


Plasmatreat USA, Inc
4th State, Inc.
1260 Elmer Street
Belmont, CA 94002

Phone: +1 650 596 1606
Fax: +1 650 596 1180

Contact: Mr. Wally Hansen
wally.hansen@plasmatreat.com

 
 
Plasma beam cleans and activates covering and sealing surfaces
"Give Leaks No Chance" - Plasma-pre-treatment protects electronics
Secure protection for electronic components
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