Gluing Chips to Circuit Boards

Components are soldered to circuit boards in a cost-effective procedure called a wave soldering process. Up-to-date processes to accomplish this are typically lead-free. Wave soldering involves a higher temperature soldering bath, however, which in turn places greater demands on the adhesion of those components to the printed circuit board.

Plasma surface activation for improved adhesive performance

Surface activation of the components’ surfaces and the chips using Openair® plasma has shown a significant improvement in the performance of the adhesive used to fix the components in place for further processing in the solder bath.

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