Topic: Desmearing. Atmospheric plasma super-fine cleaning of drilled holes in circuit boards. Abrasive plasma.

Abrasive Plasma – Alternative Procedure to Clean Drilled Holes (Desmearing) in Printed Circuit Boards

Drilled hole cleaning is an important step in printed circuit board processing prior to through-hole plating. Until now, this step was performed mainly in elaborate chemical or low-pressure plasma procedures that required interrupting the manufacturing process with separate chamber systems. In contrast, desmearing using the inline Openair® process is done in atmospheric conditions, which simplifies and accelerates the relevant process and reduces costs as well.
BohrlochreinigungDrilled hole cleaned inline
Especially in conjunction with the use of industrial gases, the Openair® process can form a strongly abrasive plasma that provides outstanding selectivity and high removal rates. The first installations of this new plasma technology are now in the preparatory stages.

back to main topic Printed circuit boards

Plasmatreat North America Inc.
1480 Sandhill Dr., Unit 8,
Ancaster, ON L9G 4V5

Phone: +1 905 304-5200
Fax: +1 905 304-5260

Contact: Mr. Tim Smith

Plasmatreat USA, Inc
2541 Technology Drive, Suite 407
Elgin, IL 60124

Phone: +1 847-783-0622
Fax: +1 847-783-0991

Contact: Mr. Jeff Leighty

Plasmatreat USA, Inc
4th State, Inc.
1260 Elmer Street
Belmont, CA 94002

Phone: +1 650 596 1606
Fax: +1 650 596 1180

Contact: Mr. Wally Hansen

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