Topic: Plasma-activation high-performance semiconductors. Super-fine wafer cleaning. Chip bonding. Gluing chips. Manufacturing semiconductors.

Non-vacuum processing – Openair® plasma unleashes new potential for the manufacture of semiconductors

Silicon wafers, chips, and high-performance semiconductors are highly sensitive electronic components. As these technologies have developed, so has low-pressure plasma technology as a manufacturing process.
The enhancement of the Openair® Plasma process under atmospheric pressure opens up entirely new possibilities, in particular for automation. A vacuum is no longer required for plasma treatment, so process flows can be greatly simplified.

More advantages of Openair® Plasma systems:

  • Super-fine cleaning (component cleaning) without damaging sensitive structures;
  • Targeted functionalization of surfaces for selective additional processing;
  • Lean process layout, noticeable cost savings; and
  • Lower error rates in bonding processes.

Canada
Plasmatreat North America Inc.
1480 Sandhill Dr., Unit 8,
Ancaster, ON L9G 4V5
Canada

Phone: +1 905 304-5200
Fax: +1 905 304-5260

Contact: Mr. Tim Smith
tim.smith@plasmatreat.com


USA
Plasmatreat USA, Inc
2541 Technology Drive, Suite 407
Elgin, IL 60124

Phone: +1 847-783-0622
Fax: +1 847-783-0991

Contact: Mr. Jeff Leighty
jeff.leighty@plasmatreat.com


Plasmatreat USA, Inc
4th State, Inc.
1260 Elmer Street
Belmont, CA 94002

Phone: +1 650 596 1606
Fax: +1 650 596 1180

Contact: Mr. Wally Hansen
wally.hansen@plasmatreat.com

 
 
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parts2clean
Leading International Trade Fair for Industrial Parts and Surface Cleaning

May 31 – June 2, 2016
Hall 5, Booth E19
Messegelände Stuttgart, Germany

DRUPA

May 31 – June 10, 2016
Hall 11, Booth D29
Düsseldorf Fairgrounds , Germany

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